MARTIN SMT Soldering Stations & Accessories

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HT00.0013
HT00.0013 - Temperature Sensor, K-Type, 0.1mm, for use with 04S Mini Oven

2352980

Temperature Sensor, K-Type, 0.1mm, for use with 04S Mini Oven

MARTIN SMT

TEMPERATURE SENSOR, K TYPE, 0.1MM; Accessory Type:Temperature Sensor; For Use With:MINIOVEN 04 S BGA-Reballer; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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VD90.5006
VD90.5006 - Solder Pellets, for BGA Reballing, 0.6 mm, 183 °C, 47 g

2352922

Solder Pellets, for BGA Reballing, 0.6 mm, 183 °C, 47 g

MARTIN SMT

SOLDER BALLS, 63/37, 220 DEG, 600UM; Solder Alloy:63, 37 Sn, Pb; Melting Temperature:183°C; Diameter:0.6mm; Weight - Metric:47g; Weight - Imperial:1.658oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:47g

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VD90.5009
VD90.5009 - Solder Pellets, for BGA Reballing, 0.5 mm, 183 °C, 27 g

2352926

Solder Pellets, for BGA Reballing, 0.5 mm, 183 °C, 27 g

MARTIN SMT

SOLDER BALLS, 63/37, 220 DEG, 500UM; Solder Alloy:63, 37 Sn, Pb; Melting Temperature:183°C; Diameter:0.5mm; Weight - Metric:27g; Weight - Imperial:0.952oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:27g

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HT00.0119
HT00.0119 - Solder Flux, Soldering, Jar, 18 g

2352952

Solder Flux, Soldering, Jar, 18 g

MARTIN SMT

FLUX, CREME, TUB, LEAD FREE, 18G; Flux Type:-; Flux Applications:Soldering; Dispensing Method:Jar; Volume:-; Weight:18g; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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HT00.0117
HT00.0117 - Solder Flux, No Clean, Soldering, Bottle, 100 g

3775757

Solder Flux, No Clean, Soldering, Bottle, 100 g

MARTIN SMT

SOLDER FLUX, BOTTLE, NO CLEAN, 100G;

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1+ NT$3,736.62

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LW40.0236
LW40.0236 - Reballing Fixture, 45x45mm, for use with 04S Mini Oven

2352902

Reballing Fixture, 45x45mm, for use with 04S Mini Oven

MARTIN SMT

REBALLING FIXTURE, BGA, 45X45MM, MO-04; Accessory Type:Reballing Fixture; For Use With:MINIOVEN 04 S BGA-Reballer; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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1+ NT$13,173.51

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HB00.0050
HB00.0050 - Hot Plate, 230 V, Hotbeam 04, 500 W

3775739

Hot Plate, 230 V, Hotbeam 04, 500 W

MARTIN SMT

HOT PLATE, 105MM X 130MM, 500W, 230V;

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1+ NT$53,815.91

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DB15.0021
DB15.0021 - Filter for Vacuum Pens, Fine

2352951

Filter for Vacuum Pens, Fine

MARTIN SMT

FILTER, FINE; Accessory Type:Filter; For Use With:Vacuum Pen; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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Pack of  6

1+ NT$2,060.83

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LW50.9001
LW50.9001 - KIT, REBALLING, BGA, STANDARD

2365979

KIT, REBALLING, BGA, STANDARD

MARTIN SMT

KIT, REBALLING, BGA, STANDARD; Accessory Type:Standard Reball Set; For Use With:Martin SMT MINIOVEN-04S REBALLER; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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1+ NT$74,906.73

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LW40.0438
LW40.0438 - Reballing Frame, BGA, 35x35mm, for use with 04S Mini Oven

2352908

Reballing Frame, BGA, 35x35mm, for use with 04S Mini Oven

MARTIN SMT

REBALLING FRAME, BGA, 35X35MM; Accessory Type:Reballing Frame; For Use With:MINIOVEN 04 S BGA-Reballer; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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1+ NT$13,442.35

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VD90.5005
VD90.5005 - Solder Pellets, for BGA Reballing, 0.3 mm, 183 °C, 6 g

2352937

Solder Pellets, for BGA Reballing, 0.3 mm, 183 °C, 6 g

MARTIN SMT

SOLDER BALLS, 63/37, 220 DEG, 300UM; Solder Alloy:63, 37 Sn, Pb; Melting Temperature:183°C; Diameter:0.3mm; Weight - Metric:6g; Weight - Imperial:0.212oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:6g

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LW40.0686
LW40.0686 - Reballing Mask, BGA, 45x45mm, N:1156,762UM, for use with 04S Mini Oven

2352913

Reballing Mask, BGA, 45x45mm, N:1156,762UM, for use with 04S Mini Oven

MARTIN SMT

REBALLING MASK, BGA,45X45MM,N:1156,762UM; Accessory Type:Reballing Mask; For Use With:MINIOVEN 04 S BGA-Reballer; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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1+ NT$13,203.38

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LW40.0450
LW40.0450 - Reballing Frame, BGA, 31x31mm, for use with 04S Mini Oven

2352907

Reballing Frame, BGA, 31x31mm, for use with 04S Mini Oven

MARTIN SMT

REBALLING FRAME, BGA, 31X31MM; Accessory Type:Reballing Frame; For Use With:MINIOVEN 04 S BGA-Reballer; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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SF42.0002
SF42.0002 - Positioning Arm, Single Head Placer, for use with Master IXH BGA Rework System

2352944

Positioning Arm, Single Head Placer, for use with Master IXH BGA Rework System

MARTIN SMT

POSITIONING ARM, SINGLE HEAD PLACER; Accessory Type:Positioning Arm; For Use With:MASTER IXH BGA Rework System; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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1+ NT$55,830.50

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EB16.0002
EB16.0002 - Desoldering Iron, 300 W, 230 V AC

2352943

Desoldering Iron, 300 W, 230 V AC

MARTIN SMT

DESOLDERING IRON, 300W, 35 L/MIN; Supply Voltage V AC:230V; Heat Temperature Max:-; Input Power:300W; Length:-; Product Range:-; Plug Type:-; SVHC:No SVHC (15-Jun-2015)

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VD90.5008
VD90.5008 - Solder Pellets, for BGA Reballing, 0.4 mm, 183 °C, 14 g

2352933

Solder Pellets, for BGA Reballing, 0.4 mm, 183 °C, 14 g

MARTIN SMT

SOLDER BALLS, 63/37, 220 DEG, 400UM; Solder Alloy:63, 37 Sn, Pb; Melting Temperature:183°C; Diameter:0.4mm; Weight - Metric:14g; Weight - Imperial:0.494oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:14g

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VD90.5105
VD90.5105 - Solder Pellets, for BGA Reballing, 0.3 mm, 220 °C, 5.2 g

2352936

Solder Pellets, for BGA Reballing, 0.3 mm, 220 °C, 5.2 g

MARTIN SMT

SOLDER BALLS, 96.5/3/0.5, 183 DEG, 300UM; Solder Alloy:96.5, 3, 0.5 Sn, Ag, Cu; Melting Temperature:220°C; Diameter:0.3mm; Weight - Metric:5.2g; Weight - Imperial:0.183oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:5.2g

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VD90.5106
VD90.5106 - Solder Pellets, for BGA Reballing, 0.6 mm, 220 °C, 42 g

2352923

Solder Pellets, for BGA Reballing, 0.6 mm, 220 °C, 42 g

MARTIN SMT

SOLDER BALLS, 96.5/3/0.5, 183 DEG, 600UM; Solder Alloy:96.5, 3, 0.5 Sn, Ag, Cu; Melting Temperature:220°C; Diameter:0.6mm; Weight - Metric:42g; Weight - Imperial:1.482oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:42g

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VD90.5004
VD90.5004 - Solder Pellets, for BGA Reballing, 0.25 mm, 183 °C, 3.5 g

2352939

Solder Pellets, for BGA Reballing, 0.25 mm, 183 °C, 3.5 g

MARTIN SMT

SOLDER BALLS, 63/37, 183 DEG, 250UM; Solder Alloy:63, 37 Sn, Pb; Melting Temperature:183°C; Diameter:0.25mm; Weight - Metric:3.5g; Weight - Imperial:0.123oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:3.5g

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LW40.1024
LW40.1024 - Desoldering Tip, BGA Solder Tools, Desoldering, 15 mm x 15 mm

2352958

Desoldering Tip, BGA Solder Tools, Desoldering, 15 mm x 15 mm

MARTIN SMT

NOZZLE, BGA, 15X15MM; For Use With:BGA Solder Tools; Tip / Nozzle Style:Desoldering; Tip / Nozzle Width:15mm; Tip / Nozzle Length:15mm; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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LW40.0432
LW40.0432 - Reballing Frame, BGA, 37.5x37.5mm, for use with 04S Mini Oven

2352909

Reballing Frame, BGA, 37.5x37.5mm, for use with 04S Mini Oven

MARTIN SMT

REBALLING FRAME, BGA, 37.5X37.5MM; Accessory Type:Reballing Frame; For Use With:MINIOVEN 04 S BGA-Reballer; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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LW40.1099
LW40.1099 - Desoldering Tips, BGA Solder Tools, Desoldering, 7 Pieces

2352966

Desoldering Tips, BGA Solder Tools, Desoldering, 7 Pieces

MARTIN SMT

KIT, NOZZLE, BGA, 7 PIECES; For Use With:BGA Solder Tools; Tip / Nozzle Style:Desoldering; Tip / Nozzle Width:-; Tip / Nozzle Length:-; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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LW40.1040
LW40.1040 - Desoldering Tip, BGA Solder Tools, Desoldering, 40 mm x 40 mm

2352964

Desoldering Tip, BGA Solder Tools, Desoldering, 40 mm x 40 mm

MARTIN SMT

NOZZLE, BGA, 40X40MM; For Use With:BGA Solder Tools; Tip / Nozzle Style:Desoldering; Tip / Nozzle Width:40mm; Tip / Nozzle Length:40mm; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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VD90.5109
VD90.5109 - Solder Pellets, for BGA Reballing, 0.5 mm, 220 °C, 24 g

2352925

Solder Pellets, for BGA Reballing, 0.5 mm, 220 °C, 24 g

MARTIN SMT

SOLDER BALLS, 96.5/3/0.5, 220 DEG, 500UM; Solder Alloy:96.5, 3, 0.5 Sn, Ag, Cu; Melting Temperature:220°C; Diameter:0.5mm; Weight - Metric:24g; Weight - Imperial:0.847oz; Product Range:-; SVHC:No SVHC (15-Jun-2015); Weight:24g

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SF30.0004
SF30.0004 - PCB Support, 40.5mm, 1.5mm, Pack of 4, for use with Master IXH BGA Rework System

2352981

PCB Support, 40.5mm, 1.5mm, Pack of 4, for use with Master IXH BGA Rework System

MARTIN SMT

PCB SUPPORT, 40.5MM, 1.5MM, PK4; Accessory Type:PCB Support; For Use With:MASTER IXH BGA Rework System; Product Range:-; SVHC:No SVHC (15-Jun-2015)

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1+ NT$3,941.04

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