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產品訊息
製造商產品編號SBBTH1510-1
訂購代碼3549302
技術資料表
Board TypeBreadboard
Board MaterialEpoxy Glass Composite
Hole Diameter1mm
External Height44.5mm
External Width27.9mm
Board Thickness1.6mm
SVHCNo SVHC (04-Feb-2026)
產品總覽
High quality lead-free, through hole solder-in breadboard. Hole pitch of 2.54mm (0.1") center-to-center. Pads are 2.0mm (0.079") round in size. Space between pads is 0.54mm (0.021").Fully RoHS 3 & REACH compliant.
- 15 Row layout with 10 columns (150 holes total)
- 1mm (40mils) hole diameter
- Holes accept 25 mil square wire wrap posts
- Fully RoHS 3 & REACH compliant
- FR-4 UL94V-0 PCB construction with max. reflow temperature up to 260°C
- Operating temperature range: -40°C to +130°C
技術規格
Board Type
Breadboard
Hole Diameter
1mm
External Width
27.9mm
SVHC
No SVHC (04-Feb-2026)
Board Material
Epoxy Glass Composite
External Height
44.5mm
Board Thickness
1.6mm
技術文件 (1)
法規與環境保護
原產地:
承擔產品生產最後程序之國家原產地:Canada
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地:Canada
承擔產品生產最後程序之國家
關稅編號:85340019
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定:是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
SVHC:No SVHC (04-Feb-2026)
下載產品合規憑證
產品合規憑證
重量 (公斤):.000091

