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637-10ABEP
Heat Sink, For Board Level Power Semiconductor, 5.8 °C/W, TO-220, 34.9 mm, 25.4 mm, 12.7 mm
產品訊息
技術文件 (1)
產品總覽
The 637-10ABEP is a 12.7mm power semiconductor Heat Sink with aluminium construction, black anodized finish, 5.8°C/W thermal resistance. This heat sink features wave-solderable pins on 1-inch centres for vertical mounting on printed circuit boards. Use this heat sink where weight and board space occupied is minimized.
- High efficiency
- Board level
應用
HVAC
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