列印頁面
圖片僅供舉例說明。 請參閱產品描述。
189 有存貨
需要更多?
189 件可于 3-4 個工作日後配送(英國 件庫存)
| 數量 | 價格 |
|---|---|
| 1+ | NT$2,187.590 |
| 5+ | NT$1,914.140 |
| 10+ | NT$1,629.870 |
價格Each
最少: 1
多項: 1
NT$2,187.59
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品訊息
製造商BERGQUIST
製造商產品編號SP400-0.007-00-1212-NA
訂購代碼8783616
Product RangeSil-Pad Series
技術資料表
Thermal Conductivity0.9W/m.K
Conductive MaterialSilicone, Fibreglass
Thickness177.8µm
Thermal Impedance1.82°C/W
Dielectric Strength-
External Length19.05mm
External Width12.7mm
Product RangeSil-Pad Series
SVHCNo SVHC (25-Jun-2025)
產品總覽
SIL PAD TSP 900 is a silicone-based, thermally-conductive and electrically-insulating thermal interface solution provides excellent cut-through resistance. It is flame-retardant, has excellent mechanical and physical characteristics, and its thermal resistance only improves with age. Ideal for electrically isolating power sources from heat sinks.
- Suitable for a variety of different packages
- Clean, grease-free and flexible
- 0.45°C/W thermal resistance
- Electrically isolating to 3.5KV (min)
- Silicon rubber/fibreglass
- -60℃ to +180℃ operating temperature
- 0.18mm thickness
技術規格
Thermal Conductivity
0.9W/m.K
Thickness
177.8µm
Dielectric Strength
-
External Width
12.7mm
SVHC
No SVHC (25-Jun-2025)
Conductive Material
Silicone, Fibreglass
Thermal Impedance
1.82°C/W
External Length
19.05mm
Product Range
Sil-Pad Series
相關產品
找到 1 個產品
法規與環境保護
原產地:
承擔產品生產最後程序之國家原產地:United States
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地:United States
承擔產品生產最後程序之國家
關稅編號:85479000
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定:是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
SVHC:No SVHC (25-Jun-2025)
下載產品合規憑證
產品合規憑證
重量 (公斤):.137403