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產品訊息
製造商產品編號DILB18P223TLF复制
訂購代碼2678539
No. of Contacts18Contacts
Connector TypeDIP Socket
Pitch Spacing2.54mm
Product Range-
Row Pitch7.62mm
Contact MaterialCopper Alloy
Contact PlatingTin Plated Contacts
SVHCNo SVHC (17-Dec-2015)
DILB18P223TLF 的替代選擇
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產品總覽
The DILB18P223TLF is a 18-position 2-row black open frame stamped and formed DIP Socket with standard insulator. It has tin plated copper alloy contacts and UL94V-0 polyester insulator. Integrated circuits are usually called ICs or chips. They are complex circuits which have been etched onto tiny chips of semiconductor (silicon). The chip is packaged in a plastic holder with pins spaced on a 0.1-inch grid which will fit the holes on stripboard and breadboards. Very fine wires inside the package link the chip to the pins.
- 9 Contacts per row
- 1000VACrms Minimum withstanding voltage
- 30MΩ Maximum at 6VDC Contact resistance
應用
Industrial
技術規格
No. of Contacts
18Contacts
Pitch Spacing
2.54mm
Row Pitch
7.62mm
Contact Plating
Tin Plated Contacts
Connector Type
DIP Socket
Product Range
-
Contact Material
Copper Alloy
SVHC
No SVHC (17-Dec-2015)
技術文件 (1)
法規與環境保護
原產地:
承擔產品生產最後程序之國家原產地:Taiwan
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地:Taiwan
承擔產品生產最後程序之國家
關稅編號:85366930
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定:是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
SVHC:No SVHC (17-Dec-2015)
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產品合規憑證
重量 (公斤):.00221

