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產品訊息
製造商BERGQUIST
製造商產品編號GP2500-0.040-02-0404复制
訂購代碼8783497
Product RangeGAP PAD TGP Series
技術資料表
Thermal Conductivity2.7W/m.K
Conductive MaterialFilled Silicone Polymer
Thickness1.016mm
Thermal Impedance0.74°C/W
Dielectric Strength-
External Length101.6mm
External Width101.6mm
Product RangeGAP PAD TGP Series
SVHCNo SVHC (25-Jun-2025)
產品總覽
Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is ideal for applications where you need high thermal performance and high conformability from a non reinforced pad that is inherently tacky.
- Eliminates air gaps to reduce thermal resistance
- Highly conformable to reduce interfacial resisitance
- Low-stress vibration dampening
- Compatible with automated dispensing equipment
- Supplied in a 100 x 100mm sheet
技術規格
Thermal Conductivity
2.7W/m.K
Thickness
1.016mm
Dielectric Strength
-
External Width
101.6mm
SVHC
No SVHC (25-Jun-2025)
Conductive Material
Filled Silicone Polymer
Thermal Impedance
0.74°C/W
External Length
101.6mm
Product Range
GAP PAD TGP Series
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法規與環境保護
原產地:
承擔產品生產最後程序之國家原產地:United States
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地:United States
承擔產品生產最後程序之國家
關稅編號:85479000
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定:是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:待通知
SVHC:No SVHC (25-Jun-2025)
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產品合規憑證
重量 (公斤):.03
