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CCI09
Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.96 °C/W, BGA, 30 mm, 6 mm, 30 mm
不再生產
產品總覽
The CCI09 is a 9 x 30 x 30mm double sided adhesive BGA Heat Sink made of aluminium body. The double sided adhesive provides simple and effective attachment. This heat sink is used for a variety of applications requiring simple extension of surface area for cooling and typically used with DSP, FPGAs and other electronics packages.
應用
Industrial
技術規格
Thermal Resistance
9.96°C/W
External Width - Metric
30mm
External Length - Metric
30mm
Heat Sink Material
Aluminium
External Diameter - Imperial
-
Packages Cooled
BGA
External Height - Metric
6mm
External Diameter - Metric
-
External Height - Imperial
0.24"
Product Range
-
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
關稅編號：76041090
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:待通知
下載產品合規憑證
產品合規憑證
重量 (公斤)：.00635