GPHC3.0-0.080-02-0816

GPHC3.0-0.080-02-0816 is a GAP PAD HC 3.0 soft and compliant gap filling material with a thermal conductivity of 3.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique 3.0W/m-K filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. GAP PAD HC 3.0 maintains a conformable nature that allows for quick recovery and excellent wet-out characteristics, even to surfaces with high roughness and/or topography. GAP PAD HC 3.0 is offered with natural inherent tack on both sides of the material, eliminating the need for thermally impeding adhesive layers. The top side has minimal tack for ease of handling. GAP PAD HC 3.0 is supplied with protective liners on both sides.

• High-compliance, low compression stress
• Fiberglass-reinforced for shear and tear resistance
• Natural tack, both sides (with fiberglass)
• 0.080" (2.03mm) standard thickness
• 8" x 16" standard sheet size