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NC551-10CC
Solder Flux, Liquid, Lead Free Soldering, Syringe, 10 cc, 10 g
Image is for illustrative purposes only. Please refer to product description.
ManufacturerCHIP QUIK
Manufacturer Part NoNC551-10CCCopy
Manufacturer Standard Lead Time7 weeks
Order Code4715885
Your Part Number
Available to Order
Manufacturer Standard Lead Time: 7 week(s)
Notify me when back in stock
| Quantity | Price |
|---|---|
| 1+ | NT$734.950 |
| 3+ | NT$719.770 |
Price for:Each
Minimum: 1
Multiple: 1
NT$734.95
Line Note
Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Overview
No-clean tack flux, used for touch up and rework, attachment of BGA spheres, soldering flip chip components. Very low viscosity synthetic paste flux.
- More robust, higher activity, better wetting, no-clean
- Ideal for all rework, solder, de-solder and reflow applications
- Non-corrosive, non-conductive
- Tack flux will not run all over PCB when applied
- Has a pleasant odour
- Excellent wetting
- Easily cleaned with isopropyl alcohol (IPA)
- Attachment of BGA spheres
- Soldering flip chip components
- Long stencil life
- Wide process window
- Clear residue
- Can be used with Leaded and Lead-Free applications
Technical Specifications
Flux Type
Liquid
Dispensing Method
Syringe
Weight
10g
SVHC
No SVHC (21-Jan-2025)
Flux Applications
Lead Free Soldering
Volume
10cc
Product Range
-
Technical Docs (1)
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:Canada
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:Canada
Country in which last significant manufacturing process was carried out
Tariff No:38109090
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (21-Jan-2025)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.024