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| Quantity | Price |
|---|---|
| 1+ | NT$271.780 |
| 10+ | NT$231.010 |
| 100+ | NT$201.360 |
| 250+ | NT$194.680 |
Price for:Each
Minimum: 1
Multiple: 1
NT$271.78
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Added to your Order Confirmation, Invoice, and Dispatch note for this order only.
Product Information
ManufacturerTE CONNECTIVITY
Manufacturer Part No2317857-2
Order Code2946012
Accessory TypeDust & EMI Cover
For Use WithAMP OSFP I/O Connectors
Connector Body MaterialZinc Alloy Body
Product Range-
SVHCNo SVHC (27-Jun-2024)
Product Overview
TE's octal small form-factor pluggable (OSFP) I/O connectors support aggregatedata rates up to 200 Gbps (8 x 28G NRZ) and 400 Gbps (8 x 56G PAM-4), with a roadmap to 112 Gbps PAM-4. They utilize integrated thermal heatsink technology in the plug to provide superior performance and signal integrity needed at 400G data rates and can fit 36 ports of an 8 lane interface in a 1RU switch form factor, aligning with current and next-generation silicon roadmaps
- Applications: Servers, Switches, Storage Devices, Routers etc.
Applications
Communications & Networking, Data / Computing, Industrial, Telecommunications
Technical Specifications
Accessory Type
Dust & EMI Cover
Connector Body Material
Zinc Alloy Body
SVHC
No SVHC (27-Jun-2024)
For Use With
AMP OSFP I/O Connectors
Product Range
-
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Tariff No:85389099
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (27-Jun-2024)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.01458