2506031027Y0

The 2506031027Y0 is a multi-layer Chip Bead to suppress conducted EMI signals. Chip beads can be used in an array of devices such as cellular phones, computers, laptops, pagers, etc. The small package sizes accommodate automated placements and allow for a dense packaging of circuit boards. Chip beads are 100% tested for impedance and DC resistance. They are available in standard, high and GHz signal speeds. The multi-layer chip beads are organized by increasing package size and current carrying capacity.

• Chip Beads are Measured for Impedance on HP 4291A and Fixture HP 16192A
• Chip Beads have plated contacts, 100% Tin over Nickel undercoating
• Suggested Land Patterns are in Accordance to the Latest Revision of IPC-7351
• -55°C to 125°C Recommended Storage and Operating Temperature Range
• 0603 Package Size

應用

Industrial