A15324-01

The A15324-01 is a 1mm Thermal Gap Filler with unique silicone gel offers compliancy and thermal resistance at pressures of 50psi will deflect to over 50% the original thickness. This high rate of compliancy allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2W/mK, low thermal resistances can be achieved at low pressures. Tflex™ 300-H is offered with a hard, metalized liner option for easy handling and improved rework. The metalized liner's lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. It is suitable for flat panel displays, memory modules, set top box, lighting ballast, handheld electronics, optical disk drives and vibration dampening applications.

• Extreme compliancy allows material to totally blanket components
• Low compression set enables the pad to be reused many times
• UL94V-0 Flammability rating
• -40 to 160°C Operating temperature
• ±10% Thickness tolerance
• 0.56% Out-gassing TML
• 0.10% Out-gassing CVCM
• 600ppm/c Coefficient thermal expansion (CTE)

應用

Thermal Management, Communications & Networking, Computers & Computer Peripherals, Power Management, Lighting, LED Lighting, Automotive