173300-0106

Molex's SpeedEdge Edge-Card connector system is rugged enough to mate safely with large PCBs in high-cycle applications while providing a high-density, low-profile solution with data rates to over 40 Gbps per differential pair. They are mechanically robust with thicker walls and higher stack height when compared to other mezzanine systems and securely hold thick PCBs; delivers durability and high-mating cycles. The Split-pad PCB design allows for electrical tuning performance to reach data rates to over 40 Gbps per differential pair.

• Voltage (max) is 250VAC
• Current (max) is 1.0A per pin
• Contact resistance is 20mohm
• Dielectric withstanding voltage is 300VAC
• Insulation resistance is 10Mohm

應用

Communications & Networking, Consumer Electronics, Aerospace, Defence, Military, Medical