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產品訊息
製造商MULTICOMP
製造商產品編號MCBB830K
訂購代碼2764647
技術資料表
Breadboard TypeSolderless Breadboard
Total Number of Tie Points830Tie Points
No. of Distribution Strips / Buses2Bus Strips
No. of Terminal Strips1 Terminal Strip
Board Dimensions (L x W) - Imperial6.5" x 2.2"
Board Dimensions (L x W) - Metric165mm x 56mm
SVHCTo Be Advised
MCBB830K 的替代選擇
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產品總覽
Great value and wide range of prototyping breadboards. Get prototyping your design with our range of solderless breadboards from Multicomp. Available in various sizes and configurations
- Copper with nickel plated spring clips
- Wire range from 29AWG to 20AWG
- Rated voltage is 300V
- Rated current is 3A to 5A
- 1 terminal strip of 630 tie-point, 2 distribution strip of 200 tie-point
- 2.54mm pitch
- Dimension is 56mm x 165.3mm x 8.3mm
- Black metal plate is 183mm x 105mm x 1mm, 3 binding posts
- Multicomp products are rated 4.6 out of 5 stars
- 12 month limited warranty *view Terms & Conditions for details
- 96% of customers would recommend to a friend
技術規格
Breadboard Type
Solderless Breadboard
No. of Distribution Strips / Buses
2Bus Strips
Board Dimensions (L x W) - Imperial
6.5" x 2.2"
SVHC
To Be Advised
Total Number of Tie Points
830Tie Points
No. of Terminal Strips
1 Terminal Strip
Board Dimensions (L x W) - Metric
165mm x 56mm
技術文件 (1)
法規與環境保護
原產地:
承擔產品生產最後程序之國家原產地:China
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地:China
承擔產品生產最後程序之國家
關稅編號:85340019
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定:待通知
符合 RoHS 鄰苯二甲酸酯類規定:待通知
SVHC:To Be Advised
下載產品合規憑證
產品合規憑證
重量 (公斤):2.608154