列印頁面
8003
PCB, Pad-per-hole, Epoxy Glass Composite, 1.57mm, 114.3mm x 165.1mm
可供訂購
製造商標準交貨時間：8 週
有貨時通知我
| 數量 | 價格 |
|---|---|
| 1+ | NT$1,085.21 |
| 10+ | NT$1,010.23 |
| 25+ | NT$976.63 |
價格Each
最少: 1
多項: 1
NT$1,085.21
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品訊息
製造商產品編號8003
訂購代碼2850706
技術資料表
Board Type0
Board MaterialEpoxy Glass Composite
Hole Diameter1.067mm
External Height114.3mm
External Width165mm
Board Thickness1.57mm
產品總覽
The 8003 is a PCB Pad-per-hole and Ground Plane Prototyping Board, 0.085-inch square solder pad etched around each hole on wiring side. Accommodates any type DIP IC device or discrete component. Single sided board with pads and peripheral GND plane on one side only. No etch or plating on reverse side. Made of CEM-1. T42-1 solder terminals, R32 wire-wrap socket pin.
- T44, T46, T49, T68 Wire wrap terminals
- UL94V-0 Flammability rating
- NEMA grade material
應用
Industrial
技術規格
Board Type
0
Hole Diameter
1.067mm
External Width
165mm
Board Material
Epoxy Glass Composite
External Height
114.3mm
Board Thickness
1.57mm
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：United States
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：United States
承擔產品生產最後程序之國家
關稅編號：85340019
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：Y-Ex
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
下載產品合規憑證
產品合規憑證
重量 (公斤)：.05