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BGA-STD-080
Heat Sink, For Ball Grid Array, Standard, 10.5 °C/W, BGA, 27 mm, 25 mm, 27 mm
328 有存貨
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328 件可于 3-4 個工作日後配送(英國 件庫存)
| 數量 | 價格 |
|---|---|
| 1+ | NT$75.800 |
| 10+ | NT$70.210 |
| 25+ | NT$66.050 |
| 50+ | NT$63.370 |
| 100+ | NT$60.800 |
價格Each
最少: 1
多項: 1
NT$75.80
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
此數量將會新增至訂單確認、發票、出貨備註、網頁確認電子郵件和產品標籤。
產品訊息
製造商產品編號BGA-STD-080
訂購代碼2084440
技術資料表
Thermal Resistance10.5°C/W
Packages CooledBGA
External Width - Metric27mm
External Height - Metric25mm
External Length - Metric27mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Width - Imperial1.06"
External Height - Imperial0.98"
External Length - Imperial1.06"
External Diameter - Imperial-
Product Range-
產品總覽
The BGA-STD-080 is a standard Heat Sink with thermal tape suitable for BGA packages. With excellent thermal conductivity, cushioning and gap filling properties, the pad is an ideal thermal interface material specifically designed for heat sink attachment to MPU, chip set and other plastic encapsulated components. It consists of an aluminium foil backing coated on both sides with a very high temperature resistance acrylic adhesive. Due to its high heat performance and adhesive properties this tape can also be use to attach components to a vertical heat sink and to metal enclosure surfaces.
- Black anodised finish
應用
HVAC, Thermal Management
技術規格
Thermal Resistance
10.5°C/W
External Width - Metric
27mm
External Length - Metric
27mm
Heat Sink Material
Aluminium
External Height - Imperial
0.98"
External Diameter - Imperial
-
Packages Cooled
BGA
External Height - Metric
25mm
External Diameter - Metric
-
External Width - Imperial
1.06"
External Length - Imperial
1.06"
Product Range
-
技術文件 (1)
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：Great Britain
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：Great Britain
承擔產品生產最後程序之國家
關稅編號：76041090
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
下載產品合規憑證
產品合規憑證
重量 (公斤)：.0156