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GAP PAD TGP 1500R
Thermal Insulator, Gap Pad 1500R .010", 8" x 16" Sheet, 1.5 W/m.K, 0.254 mm, 100000 Mohm-m
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4 有存貨
20 即日起您可預購補貨
4 件可于 3-4 個工作日後配送(英國 件庫存)
| 數量 | 價格 |
|---|---|
| 1+ | NT$2,120.330 |
| 5+ | NT$1,855.290 |
| 10+ | NT$1,537.240 |
| 20+ | NT$1,394.800 |
價格Each
最少: 1
多項: 1
NT$2,120.33
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品訊息
製造商BERGQUIST
製造商產品編號GAP PAD TGP 1500R复制
製造商標準前置時間22 週
訂購代碼1893449
Product RangeGAP PAD TGP Series
技術資料表
Insulator Body Material-
Thermal Conductivity1.5W/m.K
Breakdown Voltage Vbr-
Thickness0.254mm
Volume Resistivity100000Mohm-m
Thermal Impedance-
Dielectric Strength-
Product RangeGAP PAD TGP Series
SVHCNo SVHC (25-Jun-2025)
產品總覽
The GP1500R-0.010-02-0816 is a thermally conductive reinforced Gap Filling Pad designed for areas where heat needs to be transferred to a frame chassis or other type of heat spreader. The Gap Pad 1500R has the same highly conformable, low-modulus polymer as the standard Gap Pad 1500.The fibre-glass reinforcement allows for easy material handling and enhances puncture, shear and tear resistance. The natural tack on both sides of the material allows for good compliance to mating surfaces of components, further reducing thermal resistance.
- Fibre-glass reinforced for puncture, shear and tear resistance
- Easy release construction
- Electrically isolating
- UL94V-0 Flammability rating
- Available in black colour
應用
Thermal Management, Computers & Computer Peripherals, Communications & Networking
技術規格
Insulator Body Material
-
Breakdown Voltage Vbr
-
Volume Resistivity
100000Mohm-m
Dielectric Strength
-
SVHC
No SVHC (25-Jun-2025)
Thermal Conductivity
1.5W/m.K
Thickness
0.254mm
Thermal Impedance
-
Product Range
GAP PAD TGP Series
技術文件 (1)
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：United States
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：United States
承擔產品生產最後程序之國家
關稅編號：85479000
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:待通知
SVHC:No SVHC (25-Jun-2025)
下載產品合規憑證
產品合規憑證
重量 (公斤)：.208289