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| 數量 | 價格 |
|---|---|
| 1+ | NT$852.770 |
| 5+ | NT$835.720 |
| 10+ | NT$818.660 |
| 20+ | NT$801.610 |
| 50+ | NT$784.550 |
價格Each
最少: 1
多項: 1
NT$852.77
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品總覽
Gap Pad provides an effective thermal interface between heat sinks and electronic devices where uneven surface topography, air gaps and rough surface textures are present. This is ideal for situations where you require high thermal performance and a pad thats highly conformable abd glass reinforced.
- Eliminates air gaps to reduce thermal resistance
- Highly conformable to reduce interfacial resisitance
- Low-stress vibration dampening
- Compatible with automated dispensing equipment
- Supplied in a 100 x 100mm sheet
技術規格
Thermal Conductivity
2W/m.K
Thickness
2.032mm
Dielectric Strength
-
External Width
101.6mm
SVHC
No SVHC (25-Jun-2025)
Conductive Material
-
Thermal Impedance
0.97°C/W
External Length
101.6mm
Product Range
-
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法規與環境保護
原產地:
承擔產品生產最後程序之國家原產地:United States
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地:United States
承擔產品生產最後程序之國家
關稅編號:85479000
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定:是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
SVHC:No SVHC (25-Jun-2025)
下載產品合規憑證
產品合規憑證
重量 (公斤):.066882