SIL PAD TSP Q2000

The Q3AC 300MMX300MM SHEET is a 0.005 x 12 x 12-inch glass-reinforced grease replacement thermal interface Q-Pad 3 Material which eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. Q-Pad 3 may be installed prior to soldering and cleaning without worry. When cexposed to modest heat and pressure, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fibreglass reinforcement enables Q-Pad 3 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

• UL94V-0 Flammability rating
• Eliminates processing constraints typically associated with grease
• Conforms to surface textures
• Easy to handle
• May be installed prior to soldering and cleaning without worry

應用

Safety, Industrial