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SIL PAD TSP K1100
Silicone Pad, Thermal Conductive, 1.1 W/mK, -60 °C to 180 °C, 12 mm x 17 mm Each Pad
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1,636 有存貨
1,000 即日起您可預購補貨
1,636 件可于 3-4 個工作日後配送(英國 件庫存)
| 數量 | 價格 |
|---|---|
| 1+ | NT$105.530 |
| 5+ | NT$98.220 |
| 10+ | NT$90.500 |
| 20+ | NT$84.710 |
| 50+ | NT$80.820 |
價格Pack of 10
最少: 1
多項: 1
NT$105.53
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品訊息
製造商BERGQUIST
製造商產品編號SIL PAD TSP K1100复制
製造商標準前置時間43 週
訂購代碼2097550
Product RangeSIL PAD TSP Series
技術資料表
Insulator Body MaterialSilicone Elastomer
Thermal Conductivity1.1W/m.K
Conductive MaterialSilicone Elastomer
Thickness0.15mm
Volume Resistivity1000000Mohm-m
External Length304.8mm
Thermal Impedance-
External Width304.8mm
Dielectric Strength-
Product RangeSIL PAD TSP Series
SVHCNo SVHC (25-Jun-2025)
產品總覽
SIL PAD TSP K1100 is a Sil-Pad K-6 with medium performance, film-based thermally conductive insulator. Thermally conductive polyimide film MT film is coated with an aluminium oxide/boron nitride filled silicone elastomer to deliver "boron nitride" performance. Polyimide film provides a continuous physically tough dielectric barrier against cut-through and resultant assembly failures. Applications include thermal management, thermally conductive adhesive.
- Silicone technology
- Blue-green appearance
- Polyimide film reinforcement carrier
- Operating temperature range -60 to 180°C
技術規格
Insulator Body Material
Silicone Elastomer
Conductive Material
Silicone Elastomer
Volume Resistivity
1000000Mohm-m
Thermal Impedance
-
Dielectric Strength
-
SVHC
No SVHC (25-Jun-2025)
Thermal Conductivity
1.1W/m.K
Thickness
0.15mm
External Length
304.8mm
External Width
304.8mm
Product Range
SIL PAD TSP Series
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：United States
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：United States
承擔產品生產最後程序之國家
關稅編號：85479000
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:待通知
SVHC:No SVHC (25-Jun-2025)
下載產品合規憑證
產品合規憑證
重量 (公斤)：.002