SP800-0.005-00-1212

SP800-0.005-00-1212 is a Sil-Pad® 800 high-performance insulator for low-pressure applications. It is a thermally conductive insulation material designed for applications requiring high thermal performance and electrical isolation. These applications also typically have low mounting pressures for component clamping. Sil-Pad 800 material combines a smooth and highly compliant surface characteristics with high thermal conductivity. These features optimize the thermal resistance properties at low pressure. Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247 and TO-218) mounted with spring clips. Spring clips assist with quick assembly but apply a limited amount of force to the semiconductor. The smooth surface texture of Sil-Pad 800 minimizes interfacial thermal resistance and maximizes thermal performance.

• Thermal impedance of 0.45°C-in2/W at 50psi
• High value material
• Smooth and highly compliant surface
• Electrically isolating
• 0.005" standard thickness
• No adhesive
• 12" x 12" sheets