17430M-04A

17430M-04A is a highly conformable, thermally conductive, low modulus material. It is a soft and compliant gap filling material with a thermal conductivity of 5.0 W/m-K. The material offers exceptional thermal performance at low pressures due to a unique filler package and low-modulus resin formulation. The enhanced material is ideal for applications requiring low stress on components and boards during assembly. It maintains a conformable nature that allows excellent interfacing and wet-out characteristics, even to surfaces with high roughness and/or topography. It is offered with natural inherent tack on both sides of the material, eliminating the need for thermally-impeding adhesive layers. The top side has minimal tack for ease of handling. It is supplied with protective liners on both sides.

• Thermal conductivity of 5.0W/m-K
• High-compliance, low compression stress
• Fiberglass reinforced for shear and tear resistance