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CCI08
Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.51 °C/W, BGA, 28 mm, 9 mm, 28 mm
不再生產
產品訊息
製造商CCI
製造商產品編號CCI08
訂購代碼1373295
技術資料表
Thermal Resistance9.51°C/W
Packages CooledBGA
External Width - Metric28mm
External Height - Metric9mm
External Length - Metric28mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Width - Imperial1.1"
External Height - Imperial0.35"
External Length - Imperial1.1"
External Diameter - Imperial-
Product Range-
SVHCNo SVHC (21-Jan-2025)
產品總覽
The CCI08 is a Heat Sink made of aluminium typically used with DSP, FPGAs and other electronics BGA packages. It is also suitable for variety of applications requiring simple extension of surface area for cooling. The double sided adhesive provides simple and effective attachment.
應用
HVAC, Thermal Management
技術規格
Thermal Resistance
9.51°C/W
External Width - Metric
28mm
External Length - Metric
28mm
Heat Sink Material
Aluminium
External Height - Imperial
0.35"
External Diameter - Imperial
-
SVHC
No SVHC (21-Jan-2025)
Packages Cooled
BGA
External Height - Metric
9mm
External Diameter - Metric
-
External Width - Imperial
1.1"
External Length - Imperial
1.1"
Product Range
-
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
關稅編號：76041090
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
SVHC:No SVHC (21-Jan-2025)
下載產品合規憑證
產品合規憑證
重量 (公斤)：.0065