列印頁面
CCI11
Heat Sink, BGA, FPGAs, Double Sided Adhesive, 9.38 °C/W, BGA, 40 mm, 5 mm, 40 mm
不再生產
產品訊息
製造商CCI
製造商產品編號CCI11
訂購代碼1373300
技術資料表
Thermal Resistance9.38°C/W
Packages CooledBGA
External Width - Metric40mm
External Height - Metric5mm
External Length - Metric40mm
External Diameter - Metric-
Heat Sink MaterialAluminium
External Width - Imperial1.57"
External Height - Imperial0.2"
External Length - Imperial1.57"
External Diameter - Imperial-
Product Range-
產品總覽
The CCI11 is a 5 x 40 x 40mm double sided adhesive BGA Heat Sink made of aluminium body. The double sided adhesive provides simple and effective attachment. This heat sink is used for a variety of applications requiring simple extension of surface area for cooling and typically used with DSP, FPGAs and other electronics packages.
應用
Industrial
技術規格
Thermal Resistance
9.38°C/W
External Width - Metric
40mm
External Length - Metric
40mm
Heat Sink Material
Aluminium
External Height - Imperial
0.2"
External Diameter - Imperial
-
Packages Cooled
BGA
External Height - Metric
5mm
External Diameter - Metric
-
External Width - Imperial
1.57"
External Length - Imperial
1.57"
Product Range
-
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
關稅編號：76169990
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
下載產品合規憑證
產品合規憑證
重量 (公斤)：.012