TC-5121C LV, 1KG

TC-5121C LV, 1KG is a DOWSIL™ TC-5121C LV thermally conductive compound. It is suitable for use as an interface material for a variety of mid to high-end PCB system assemblies. This thermally conductive compound is grease like silicone material, heavily filled with heat-conductive metal oxides. This combination promotes high thermal conductivity, low bleed and high-temperature stability. The compound is designed to maintain a positive heat sink seal to improve heat transfer from the electrical/PCB system assembly to the heat sink or chassis, thereby increasing the overall efficiency of the device.

• Greenish yellow, flowable, non-curing thermally conductive compound
• Optimized polymer matrix to help reduce pump out
• Flowable, good thermal conductivity, low thermal resistance
• Non-curing, no need for curing ovens, heat removal from PCB systems components
• Can achieve thin Bond Line Thickness (BLT)
• Filled polydimethylsiloxane composition
• Silicone potting compound type
• Green / yellow compound colour
• 1kg weight