列印頁面
A15896-04
Thermal Pad, Tflex HR600 Series, 5 W/m.K, Silicone, 1 mm, 229 mm
可供訂購
製造商標準交貨時間：14 週
有貨時通知我
| 數量 | 價格 |
|---|---|
| 1+ | NT$4,278.330 |
| 5+ | NT$4,057.820 |
| 10+ | NT$3,837.300 |
價格Each
最少: 1
多項: 1
NT$4,278.33
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品訊息
製造商LAIRD
製造商產品編號A15896-04复制
製造商標準前置時間14 週
訂購代碼2484752
Product RangeTflex HR600
技術資料表
Thermal Conductivity5W/m.K
Conductive MaterialSilicone
Thickness1mm
Thermal Impedance-
Dielectric Strength-
External Length229mm
External Width229mm
Product RangeTflex HR600
SVHCNo SVHC (07-Nov-2024)
產品總覽
The A15896-04 is a 1mm Thermal Gap Filler with great thermal performance and high compliancy. The soft interface pad conforms to component topography, resulting in little or no stress on the components and mating chassis or parts. Unique silicone and ceramic filler technology allows a combination of high compliancy and high thermal performance. It is suitable for use with cooling components to chassis, frame or other mating components, mass storage devices, flat panel displays and GPS navigation and other portable devices applications.
- Highly compliant
- Low thermal resistance even at low pressure
- Naturally tacky for adhesion during assembly and transport
- UL94V-0 Flammability rating
- ±10% Thickness tolerance
- -45 to 200°C Operating temperature
- 1.0% Out-gassing TML
- 0.13% Out-gassing CVCM
應用
Thermal Management, Audio, LED Lighting, Automotive, Communications & Networking
技術規格
Thermal Conductivity
5W/m.K
Thickness
1mm
Dielectric Strength
-
External Width
229mm
SVHC
No SVHC (07-Nov-2024)
Conductive Material
Silicone
Thermal Impedance
-
External Length
229mm
Product Range
Tflex HR600
技術文件 (1)
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：China
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：China
承擔產品生產最後程序之國家
關稅編號：85469090
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
SVHC:No SVHC (07-Nov-2024)
下載產品合規憑證
產品合規憑證
重量 (公斤)：.1