列印頁面
S007-V033
Embedded Module, ESP32-S3FN8, ESP32 Family, Xtensa, LX7, 32bit
可供訂購
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| 數量 | 價格 |
|---|---|
| 1+ | NT$342.510 |
價格Each
最少: 1
多項: 1
NT$342.51
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品訊息
製造商M5STACK
製造商產品編號S007-V033复制
訂購代碼4994214
技術資料表
Silicon ManufacturerEspressif Systems
No. of Bits32bit
Silicon Family NameESP32
Core ArchitectureXtensa
Core Sub-ArchitectureLX7
Silicon Core NumberESP32-S3FN8
Kit ContentsStamp-S3A Embedded Module ESP32-S3FN8, HY2.0-4P Terminal, 1.5mm Hex Key L-Shape, Pin Sticker/Headers
Product Range-
SVHCNo SVHC (04-Feb-2026)
產品總覽
S007-V033 is a M5StampS3A ESP32S3 module. The Stamp-S3A is a highly-integrated embedded module based on the Espressif ESP32-S3FN8. It is equipped with a 240MHz Xtensa® 32-bit LX7 dual-core processor, integrates 8MB flash, a programmable RGB LED, and a user button. The deeply-optimized 3D antenna design offers stronger wireless communication performance. Twenty-three GPIOs are broken out and provided via 1.27mm / 2.54mm pitch SMT/DIP pin headers or sockets, allowing effortless PCB integration and enabling developers to build applications rapidly.
- ESP32-S3FN8 (2.4 GHz Wi-Fi)
- Minimum-system board
- Rich I/O breakout supporting multiple application forms (SMT, DIP, fly-wire, Unit)
- Integrated programmable RGB LED and button
- Development platform: UiFlow2, Arduino IDE, ESP-IDF, PlatformIO
技術規格
Silicon Manufacturer
Espressif Systems
Silicon Family Name
ESP32
Core Sub-Architecture
LX7
Kit Contents
Stamp-S3A Embedded Module ESP32-S3FN8, HY2.0-4P Terminal, 1.5mm Hex Key L-Shape, Pin Sticker/Headers
SVHC
No SVHC (04-Feb-2026)
No. of Bits
32bit
Core Architecture
Xtensa
Silicon Core Number
ESP32-S3FN8
Product Range
-
技術文件 (1)
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：China
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：China
承擔產品生產最後程序之國家
關稅編號：85371010
US ECCN:5A992.c
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:待通知
SVHC:No SVHC (04-Feb-2026)
下載產品合規憑證
產品合規憑證
重量 (公斤)：.0071