MC33278

MC33278 heat sink is a highly efficient cooling solution designed for TO-220 package devices. With a thermal resistance of 7.6 °C/W, it effectively dissipates heat to ensure optimal performance and longevity of electronic components. Measuring 42 mm in length, 20 mm in width, and 38 mm in height, this twisted vane heat sink is capable of accommodating two devices simultaneously. Its robust design and twisted vane structure enhance airflow, making it ideal for applications requiring reliable thermal management.

• Twisted vane horizontal heatsinks pre-drilled to accept one or two TO-220 packages
• Accommodates two devices
• Black anodize finish