列印頁面
MC001808
Breadboard, 750 Tie Points, 8.3 mm, 99 mm, 82.1 mm
不再生產
產品訊息
製造商MULTICOMP
製造商產品編號MC001808
訂購代碼2770336
技術資料表
Breadboard TypeSolderless Breadboard
Total Number of Tie Points750Tie Points
No. of Distribution Strips / Buses3Bus Strips
No. of Terminal Strips2 Terminal Strips
Board Dimensions (L x W) - Imperial3.23" x 3.89"
Board Dimensions (L x W) - Metric82mm x 99mm
SVHCTo Be Advised
產品總覽
Great value and wide range of prototyping breadboards. Get prototyping your design with our range of solderless breadboards from Multicomp. Available in various sizes and configurations
- Pitch spacing is 2.54mm
- Two terminal strip with 600 tie-points and three distribution strips with 150 tie-points
- Rated voltage is 300V
- Rated current is 3A to 5A
- Insulation resistance is 500Mohm at 500VDC
- Withstanding voltage is 1000VAC/1min
- Wire size range from 29AWG to 20AWG
- Temperature range from -25°C to +80°C
- 7mm to 8mm strip length, dimension of the board is 99mm x 82.1mm (L x W)
- Multicomp products are rated 4.6 out of 5 stars
- 12 month limited warranty *view Terms & Conditions for details
- 96% of customers would recommend to a friend
應用
Hobby & Education
技術規格
Breadboard Type
Solderless Breadboard
No. of Distribution Strips / Buses
3Bus Strips
Board Dimensions (L x W) - Imperial
3.23" x 3.89"
SVHC
To Be Advised
Total Number of Tie Points
750Tie Points
No. of Terminal Strips
2 Terminal Strips
Board Dimensions (L x W) - Metric
82mm x 99mm
技術文件 (1)
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：China
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：China
承擔產品生產最後程序之國家
關稅編號：85340019
US ECCN:EAR99
EU ECCN:NLR
符合 RoHS 規定：是
RoHS
符合 RoHS 鄰苯二甲酸酯類規定:是
RoHS
SVHC:To Be Advised
下載產品合規憑證
產品合規憑證
重量 (公斤)：.1