MCIMX8ULP-EVK9

MCIMX8ULP-EVK9 i.MX 8ULP evaluation kit 9 (EVK9) provides a platform for comprehensive evaluation of the 9.4x9.4mm i.MX 8ULP applications processors. The two-board solution consists of a compute module that contains i.MX 8ULP SoC (9.4x9.4mm), LPDDR4, PMIC, Octal SPI NOR flash, Octal SPI pSRAM, and eMMC and a base board that brings out the broad connectivity that is needed for product evaluation. This kit provides an excellent starting point to accelerate your own design. Suitable for automotive, Industrial and consumer applications.

• i.MX 8ULP applications processor, dual Cortex-A35/M33 at 800MHz/216, EdgeLock® secure enclave
• Cadence® Tensillica® Hifi 4 DSP at 600MHz, Cadence® Tensilica® Fusion DSP at 200MHz
• Memory: 2GB LPDDR4, 32GB eMMC, 32/64MB octal SPI Nor flash on RTD/APD, 8MB octal-SPI pSRAM on RTD
• Power management: NXP PCA9460A PMIC
• Display and camera interfaces: HDMI output, MIPI-DSI, miniSAS MIPI-CSI connectors
• Wireless: NXP IW416: Wi-Fi 1x1 dual-band (2.4/ GHz) and Bluetooth 5.2
• Onboard PCB antenna Wi-Fi 4 (802.11n), external antenna connector
• Audio: 3.5mm Audio stereo headphone jack, I2S expansion header -J12
• Connectivity: connector (2x USB C 2.0, 1x 10/100M ethernet RJ45, ADC/DAC ), CAN header
• Security: tamper detect switch and Linux®, Android®, FreeRTOS™ OS support

內容

i.MX 8ULP CPU module based on the i.MX 8ULP 9.4x9.4 package, Base board, Quick start guide, 1x USB type-C to standard-A cable, 1x USB micro-B to standard-A cable, Power supply.