列印頁面
HM21LB1C2LAE
Hailo 8L AI Module, M.2 Key B+M 2280, PCIe Gen3x2, 1.5W, 13 TOPS, -40 °C to 85 °C
可供訂購
在這裡登記您有興趣的產品
| 數量 | 價格 |
|---|---|
| 1+ | NT$2,817.040 |
價格Each
最少: 1
多項: 1
NT$2,817.04
品項附註
僅針對此訂單新增至訂單確認、發票和出貨備註。
產品訊息
製造商產品編號HM21LB1C2LAE复制
訂購代碼4906520
Product RangeHailo-8L Series
技術資料表
Product RangeHailo-8L Series
Thermal Cooling Type-
Total Power Max6.6W
Memory Capacity-
Interface TypePCIe Gen3x2
Network Interfaces-
Operating Temperature Min-40°C
Operating Temperature Max85°C
SVHCNo SVHC (04-Feb-2026)
產品總覽
HM21LB1C2LAE is a Hailo-8L M.2 Key B+M 2280 AI accelerator module delivering 13 Tera-Operations Per Second (TOPS). This enables real-time, low latency and high-efficiency AI inferencing on edge devices, allowing scalable simultaneous processing of multi-stream and multi models. A robust software suite supports state-of-the-art deep learning models and applications out-of-the-box.
- PCIe Gen-3.0 interface
- Supports both x86- and ARM-based host architectures
- Supports Linux and Windows operating systems
- Supports TensorFlow, TensorFlow Lite, Keras, PyTorch, and ONNX AI frameworks
- Supporting extended temperature range from -40°C to 85°C
技術規格
Product Range
Hailo-8L Series
Total Power Max
6.6W
Interface Type
PCIe Gen3x2
Operating Temperature Min
-40°C
SVHC
No SVHC (04-Feb-2026)
Thermal Cooling Type
-
Memory Capacity
-
Network Interfaces
-
Operating Temperature Max
85°C
技術文件 (1)
法規與環境保護
原產地：
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
承擔產品生產最後程序之國家原產地：Taiwan
承擔產品生產最後程序之國家
關稅編號：84733020
US ECCN:4A994.l
EU ECCN:NLR
符合 RoHS 規定：待通知
符合 RoHS 鄰苯二甲酸酯類規定:待通知
SVHC:No SVHC (04-Feb-2026)
下載產品合規憑證
產品合規憑證
重量 (公斤)：.007