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Jetson AGX Orin 32GB H01 kit is built with Jetson AGX Orin 32GB module, offering 200 TOPs AI performance as well as a carrier board including PCIe X16, GbE, 10GbE, 3 x USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 2.4/5GHz Wi-Fi, Bluetooth, 16 lane MIPI CSI-2, 40-Pin header. The kit is pre-installed with JetPack 5.0.2, has a heatsink with a cooling fan and an aluminium case, while being an alternative option for the Jetson AGX Orin Dev Kit.

• On-device processing with up to 200 TOPS AI performance with low power and low latency
• Compact size at 107mm x 106.4mm x 70.5mm
• Pre-installed JetPack 5.0.2, Linux OS BSP, support Jetson software and AI frameworks & s/w platforms

內容

Jetson AGX Orin 32GB ×1, Seeed carrier board ×1, Aluminium heatsink with fan ×1, Aluminium case ×1, 19V/4.74A (barrel jack 5.5/2.5mm) power adapter ×1.