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Thermal interface solutions sample kit includes WE-TGF thermal gap filler pad (reinforced shape: square; 100 x 100 x 1mm, thermal conductivity = 1 W/(m⋅K)), WE-PCM phase change material (shape: square; 100 x 100 x 0.2mm, thermal conductivity = 1.6W/(m⋅K)), WE-TTT thermal transfer tape (shape: square; 100mm x 100mm x 0.2mm, thermal conductivity: <gt/>=1W/(m⋅K), dielectric strength: 4KV/mm, adhesive strength: <gt/>= 5.79N/cm), WE-TINS thermally conductive insulator pad (shape: square; 65 x 65 x 0.23mm, thermal conductivity = 1.6W/(m⋅K)).

• Vertical thermal interfaces envelop
• Fill a gap to provide a path for the heat energy to flow

內容

WE-TGF thermal gap filler pad, WE-PCM phase change material, WE-TTT thermal transfer tape, WE-TINS thermally conductive insulator pad.